Wireless Silicon Integration: it’s a Long Road

With scaling up in silicon complexity, system design is increasingly merging with chip-design. Wireless communication subsystems that were once complete chips in themselves are now portions of the SoC in 65nm, 40nm and beyond. Design and development of such high-performance and ultra-low power advanced OFDM wireless communication sub-systems need multiple generations of product experience, proven silicon and deployed-solutions. Having invested more than 600 man-years in advanced 802.11n, 802.16e and next-generation LTE technologies and having 100+ US patents filed in these areas, Redpine has the right technology and solutions for system designers and SoC architects faced with the "wireless integration challenge."

Redpine has strategically partnered and delivered advanced wireless SoCs with next generation OFDM and MIMO to leading vendors. Our customers have successfully integrated and deployed complex 802.11n wireless solutions into their wireless application processors, media processors and network processors SoCs. Our advanced "at-speed" prototype platform methodology has enabled a legacy of first-pass production silicon from in all our chips (both in-house products and customer SoCs).

“We are your Wireless™”

	BEAM150 - 802.11n 1x1
	a. b. c. d. e. World’s first 1x1 802.11n Wi-Fi certified solution (Production: Q4 2007) Available in module sizes as small as 70 sq mm! Ultra low power consumption with integrated PMU, Intelligent-Power Management at both system level (adaptive turn-off of radio, host and chip components) and silicon level (power-islanding, clock gating and DVFS) Platform available for integration. Detailed list of chipsets/modules and systems based on this product at: Chipsets and Modules
	BEAM300 - 802.11n 2x2
	a. b. c. Next generation technology with on-air throughputs of upto 300 Mbps at 802.11a/b/g cost & power consumption! Platform available for SoC integrators. Further details available on request.
	BEAM450 - 802.11n 3x3
	a. b. c. d.. On-air throughputs of upto 450 Mbps. MIMO ML Receiver and Advanced Transmit Beamforming with support for both implicit and explicit. Single-chip simultaneous dual-band solution. Simultaneous dual-band at the cost and size of switched dual-band. Platform available for SoC integrators. Further details available on request.
	BEAM600 - 802.11n 4x4
	a. b. c. d. On-air throughputs of upto 600 Mbps. MIMO ML Receiver and Advanced Transmit Beamforming Tx (support for both implicit and explicit) Single-chip simultaneous dual-band solution. Simultaneous dual-band at the cost and size of switched dual-band. Platform available for SoC integrators. Further details available on request.
	802.16e - Wave-2 Mobile WiMAX
	a. b. c. d. Fully compliant to Mobile WiMax Wave-2 Advanced implementation with ML Receiver and Interference Optimal design (designed for SFN) Platform available for SoC integrators. Further details available on request.
	2x2 802.16e + 3x3 802.11n Convergence
	a. b. c. Convergence solution at same size and cost of 802.16e 2x2 stand-alone solution (no overhead). Platform available for SoC integrators. Further details available on request.
	3x3 802.11n, 2x2 802.16e, 3GPP- LTE Convergence
	a. Further details available on request.